This paper is the second of set of two dealing with exposure of moist substrates to electromagnetic energy, while providing localized convection heat and mass transfer. Solution of the comprehensive model lead to the electric distribution in the cavity–substrate ensemble, the velocity distribution in the cavity and around the substrate, and the temperature and residual moisture distributions in the substrate. The model has been successfully validated against the available experimental values, with few temperature degrees of difference, only. It was found that the dielectric loss which dictates the local energy absorption depends inversely on the local temperature, for the devised treatments. For the two extremal treatments, the volume-averaged moisture varies by some 20% only, but in one case hot spots up to 1000 K were induced at the surface, otherwise jet impingement with Reynolds number of 32k allowed to cool off the surface to as low as 300 K.
Convective control to microwave exposure of moist substrates. Part II: Model validation and application
DE BONIS, MARIA VALERIA;RUOCCO, Gianpaolo
2015-01-01
Abstract
This paper is the second of set of two dealing with exposure of moist substrates to electromagnetic energy, while providing localized convection heat and mass transfer. Solution of the comprehensive model lead to the electric distribution in the cavity–substrate ensemble, the velocity distribution in the cavity and around the substrate, and the temperature and residual moisture distributions in the substrate. The model has been successfully validated against the available experimental values, with few temperature degrees of difference, only. It was found that the dielectric loss which dictates the local energy absorption depends inversely on the local temperature, for the devised treatments. For the two extremal treatments, the volume-averaged moisture varies by some 20% only, but in one case hot spots up to 1000 K were induced at the surface, otherwise jet impingement with Reynolds number of 32k allowed to cool off the surface to as low as 300 K.File | Dimensione | Formato | |
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